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Wafer Bonder

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刊登者: 新竹縣湖口鄉-聚昌科技全部產品:8  

Description: AST Samurai Wafer Bonding System provides the complete product line covering the production scale from volume production, pilot production to RD platform for wafer level bonding application. web66 Samurai Wafer Bonding System has served Industry Application of worldwide customers from LED, Compound Semiconductor, MEMS, BioChip, Advanced Packaging, and EMI Device. 1) Metal (Eutectic) Bonding 2) Adhesive (Glue, Expoxy) 3) Anodic Bonding 4) Thermal Direct Bonding 5) Alignment Bonding 6) Advanced Packaging Bonding 7) 3D Packaging Bonding Features: Samurai series has system configuration for Eutectic, Adhesive, Anodic bonding, withindependent temperature, precise bonding pressure, voltage control and alignment mechanism design suitable for different customer application. Specification: Standard Vacuum Model handling wafer size from 2"~8" available. Please contact AST for your application. Safety Approval: TUV Country of Origin: Taiwan Main Export Markets: Worldwide

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刊登者:聚昌科技

  • WeB66會員:一般會員 
  • WeB66價值度:3.8
  • 所在地:新竹縣
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詢價Fuji MCC報價2PCS(1)FUJIMCCB單號-299443|(07)666****|***@**tpower.com.tw
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