laser diode manufacturing

U.O.C. provide semiconductor laser diodes Epitaxy growth, wafer and chip process, LD assembly (i.e. CoS, SMD, TO-cans) manufacturing and OEM/ODM service. UOC's wafer process service include: photo lithography, wet and dry etching, passivation, metalization, lapping and polishing service. Facet Coating service: bar arrangement and facet coating. Chip process: Chip arrangement, chip sorting. LD Assembly: To-package, Cos assembly and LD testing.